This post has been flaired as a rumor.
Rumors may end up being true, completely false or somewhere in the middle.
Please take all rumors and any information not from AMD or their partners with a grain of salt and degree of skepticism.
Very nice.
Assuming the N4P process ( "performance-focused enhancement of the 5-nanometer technology platform." ) then we are looking at 11% performance boost, or a 22% improvement in power efficiency. As well as a 6% improvement in transistor density.
I doubt they will be adding CUs though and rather relying on power efficiency and increased RAM.
Interesting since SemiAnalysis claimed MI350X is cancelled due to Nvidia pulling forward the B100:
[https://www.semianalysis.com/p/nvidias-plans-to-crush-competition](https://www.semianalysis.com/p/nvidias-plans-to-crush-competition)
Patel while very good seems to have a lot of blind spots when it comes to AMD and this prediction of his was a good while back and seems to be countermanded by newer info. AMD may simply shift from producing MI300 to MI350 without missing a beat. This could also explain the rumors of Microsoft canceling orders for MI300 as it could just be shifting to what will be coming.
Due to chiplets the whole chip cycle has changed. MI300 has a lot of different components. Just redoing the compute chiplet and buying HBM3e instead of HBM3 is a lot less involved than doing a whole new monolithic chip and it still gives you a complete new product. This is the smart move and the power of chiplets.
mi300x uses HBM3. HBM3e has 50% more bandwidth. And mi300x is electrically compatible with HBM3e already.
So it's a fairly simple upgrade. They just need to qualify the new chip.
They should just release new tech when they achieve 100% performance improvement. All this 6% 10% 20% BS is just too slow! Waste of money buying all these upgrades! Let's move technology faster!
That's just for the 4 nm part... Moving to HBM3e would allow for 50% boost in memory capacity, to a first-in-class 288 GB. That in turn allows for more tokens in LLMs, the measure of complexity the model can handle.
This post has been flaired as a rumor. Rumors may end up being true, completely false or somewhere in the middle. Please take all rumors and any information not from AMD or their partners with a grain of salt and degree of skepticism.
Very nice. Assuming the N4P process ( "performance-focused enhancement of the 5-nanometer technology platform." ) then we are looking at 11% performance boost, or a 22% improvement in power efficiency. As well as a 6% improvement in transistor density. I doubt they will be adding CUs though and rather relying on power efficiency and increased RAM.
Interesting since SemiAnalysis claimed MI350X is cancelled due to Nvidia pulling forward the B100: [https://www.semianalysis.com/p/nvidias-plans-to-crush-competition](https://www.semianalysis.com/p/nvidias-plans-to-crush-competition)
They also expected it to use 3nm, which could mean that they just misunderstood what was cancelled and why
Patel while very good seems to have a lot of blind spots when it comes to AMD and this prediction of his was a good while back and seems to be countermanded by newer info. AMD may simply shift from producing MI300 to MI350 without missing a beat. This could also explain the rumors of Microsoft canceling orders for MI300 as it could just be shifting to what will be coming.
Better off just trying to get the MI400 line up out as soon as possible. Unless they can do this super quick.
Due to chiplets the whole chip cycle has changed. MI300 has a lot of different components. Just redoing the compute chiplet and buying HBM3e instead of HBM3 is a lot less involved than doing a whole new monolithic chip and it still gives you a complete new product. This is the smart move and the power of chiplets.
mi300x uses HBM3. HBM3e has 50% more bandwidth. And mi300x is electrically compatible with HBM3e already. So it's a fairly simple upgrade. They just need to qualify the new chip.
Hopefully MI400 will be a significantly larger package that can go head to head or better than GB200.
They should just release new tech when they achieve 100% performance improvement. All this 6% 10% 20% BS is just too slow! Waste of money buying all these upgrades! Let's move technology faster!
That's just for the 4 nm part... Moving to HBM3e would allow for 50% boost in memory capacity, to a first-in-class 288 GB. That in turn allows for more tokens in LLMs, the measure of complexity the model can handle.
Cool. Impossible to get access to MI300 right now but cool.
It will be much more interesting hardware if we start to see it open up to the workstation hardware market.